Currently browsing: Items authored or edited by William Plumbridge

Gagg, Colin and Plumbridge, William (1996). The effect of ageing on the creep of a eutectic lead-tin alloy. In: British Association for Brazing and Soldering (BABS) Autumn Conference, 30-31 Oct 1996, Birmingham.

Hermann, R.; Moffatt, J. and Plumbridge, W. J. (1995). A comparison of crack initiation techniques for ceramics. Journal of Materials Science Letters, 14(4) pp. 282–284.

Kariya, Yoshiharu; Williams, Naomi; Gagg, Colin and Plumbridge, William (2001). Tin pest in Sn-0.5 wt.% Cu lead-free solder. JOM Journal of the Minerals, Metals and Materials Society, 53(6) pp. 39–41.

Kariya, Yoshiharu; Gagg, Colin and Plumbridge, William J. (2001). Tin pest in lead-free solders. Soldering and Surface Mount Technology, 13(1) pp. 39–40.

Kariya, Y.; Gagg, C. R.; Williams, N. and Plumbridge, W. J. (2000). Allotropic transformation study and phase mapping in tin-copper lead-free solder for electronic assembly. In: CHANNEL Users Meeting, 15-18 Jun 2000, Hobro, Denmark.

Liu, X. W. and Plumbridge, W. J. (2007). Damage Produced in Solder Alloys during Thermal Cycling. Journal of Electronic Materials, 36(9) pp. 1111–1120.

Liu, X.W. and Plumbridge, W.J. (2003). Thermomechanical fatigue of Sn–37 wt.% Pb model solder joints. Materials Science and Engineering A, 362(1-2) pp. 309–321.

Liu, X.W. and Plumbridge, W.J. (2003). Damage produced in model solder (Sn-37Pb) joints during thermomechanical cycling. Journal of Electronic Materials, 32(4) pp. 278–286.

Moffatt, J.; Plumbridge, W. and Herman, R (1996). High temperature crack annealing effects on fracture toughness of alumina and alumina-SiC composite. British Ceramic Transactions, 95(1) pp. 23–29.

Plumbridge, W. J. (2009). New avenues for failure analysis. Engineering Failure Analysis, 16(5) pp. 1347–1354.

Plumbridge, W. J. (2009). Fatigue resistance and structure (30 years on). Fatigue and Fracture of Engineering Materials and Structures, 32(6) pp. 461–463.

Plumbridge, W. J. (2008). Recent Observations on Tin Pest Formation in Solder Alloys. Journal of Electronic Materials, 37(2) pp. 218–223.

Plumbridge, W.J. (2007). Tin pest issues in lead-free electronic solders. Journal of Materials Science: Materials in Electronics, 18(1-3) pp. 307–318.

Plumbridge, W.J. (2007). Tin pest in electronics? Circuit World, 33(1) pp. 9–14.

Plumbridge, W. J. (2007). Defects in electronics and their significance for structural integrity. Fatigue and Fracture of Engineering Materials and Structures, 30(5) pp. 432–442.

Plumbridge, W.J. (2006). Implementing lead-free solders - the performance aspects. Soldering and Surface Mount Technology, 18(1) pp. 11–18.

Plumbridge, William J. (2005). Second generation lead-free solder alloys: a challenge to thermodynamics. Monatshefte fur Chemie / Chemical Monthly, 136(11) pp. 1811–1821.

Plumbridge, W.J. and Kariya, Y. (2004). Structural integrity in electronics. Fatigue and Fracture of Engineering Materials and Structures, 27(8) pp. 723–734.

Plumbridge, W.J.; Matela, R.J. and Westwater, A. (2004). Structural integrity and reliability in electronics: enhancing performance in a lead-free environment. The Netherlands: Springer.

Plumbridge, W.J. (2004). Long term mechanical reliability with lead-free solders. Soldering and Surface Mount Technology, 16(2) pp. 13–20.

Plumbridge, W.J. (2003). The analysis of creep data for solder alloys. Soldering and Surface Mount Technology, 15(1) pp. 26–30.

Plumbridge, William (2003). Mechanical evaluation in electronics. In: Suganama, K. ed. Lead-free soldering in electronics: Science, technology and environmental impact. New York: Marcel Dekker, pp. 183–218.

Plumbridge, W. J. and Gagg, C. R. (2002). The influence of temperature on the creep of tin-37 lead solders. In: TMS Fall Meeting, 6-10 Oct 2002, Columbus Ohio, USA.

Plumbridge, W. J.; Gagg, C. R. and Peters, S. (2001). The creep of lead-free solders at elevated temperatures. Journal of Electronic Materials, 30(9) pp. 1178–1183.

Plumbridge, W.; Kariya, Y. and Gagg, C. R. (2001). The influence of processing history on the creep of tin-3.5 silver alloys. In: Seventh Symposium on Microjoining and Assembly Technology in Electronics (MATE 2001), 2001, Yokohama, Japan.

Plumbridge, W. J. and Gagg, C. R. (2000). The mechanical properties of lead-containing and lead-free solders—meeting the environmental challenge. Proceedings of the Institution of Mechanical Engineers Part L, Journal of Materials: Design and Applications, 214(3) pp. 153–161.

Plumbridge, W. J. and Gagg, C. R. (1999). Effects of strain rate and temperature on the stress–strain response of solder alloys. Journal of Materials Science: Materials in Electronics, 10(5-6) pp. 461–468.

Plumbridge, W. J.; Gagg, C. R. and Moffatt, J. (1998). Solders for the Next Millennium. In: Materials Congress; Institute of Materials, 6-8 Apr 1998, Cirencester, Wilts.

Rist, Martin A.; Plumbridge, W.J. and Cooper, S. (2006). Creep-constitutive behavior of Sn-3.8Ag-0.7Cu solder using an internal stress approach. Journal of Electronic Materials, 35(5) pp. 1050–1058.

Shohji, Ikuo; Gagg, Colin and Plumbridge, William J. (2004). Creep properties of Sn-8Mass%Zn-3Mass%Bi lead-free alloy. Journal of Electronic Materials, 33(8) pp. 923–927.